Korean company SK hynix Inc. will showcase energy-efficient, high-performance memory products at CES 2023 in Las Vegas from Jan. 5th through Jan. 8th, 2023.
Attention on energy-efficient memory chips has been on the rise as global tech companies pursue products that process data faster, while consuming less energy. SK hynix says that its products at CES 2023 will meet customers’ such needs with outstanding performance per watt (an indicator of how much computation is performed per watt of power consumed).
The core product put forward at the show is PS1010 E3.S, an eSSD product composed of multiple 176-layer 4D NAND that supports the fifth generation of the PCIe (Peripheral Component Interconnect Express) interface.
SK hynix says the introduction of the PS1010, a combination of the company’s industry-leading technologies, is timely as the server chip market continues to grow despite the current industry downturn.
The PS1010 product shows improvement both in reading and writing speed by 130% and 49%, respectively, compared with the previous generation. Its performance-per-watt is also improved by more than 75%, helping customers reduce costs to run servers and carbon emission.
“We’re proud to launch PS1010, an ultrahigh-performance product with self-developed controller and firmware, at the CES 2023, the world’s largest technology show,” Yun Jae Yeun, Head of NAND Product Planning, said. “This product will solve pain point of our server-chip customers, while paving the way for a stronger competitiveness in NAND business for us.”
Other products to be introduced at the show include:
- HBM3, a memory product. HBM (High Bandwidth Memory) ia a high-value, high-performance memory that vertically interconnects multiple DRAM chips and dramatically increases data processing speed in comparison to traditional DRAM products.
- GDDR6-AiM which uses PIM (Processing In Memory), a next-generation technology that provides a solution for data congestion issues for AI and big data by adding computational functions to semiconductor memory.
- CXL memory. CXL (Compute Express Link) is a PCIe-based next-generation interconnect protocol on which high-performance computing systems are based.
SK hynix will also present the immersion cooling technology of sister company SK enmove. Immersion Cooling is a next-generation thermal-management technology that cools down temperature by submerging data servers into cooling oil. The company says total electricity consumption can be reduced by 30% compared with existing technologies that use air to cool down the heat of servers generated during operation.